Wire-to-board connector
 Wire-to-board connector · 3.0 mm · Vertical · Insulation resistance ≥1000MΩ
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Wire connectors

Wire-to-board connector · 3.0 mm · Vertical · Insulation resistance ≥1000MΩ

Series specification range: Pitch: 3.0 mm · Mounting orientation: Vertical

Quotation and selection support
Pitch
3.0 mm
Mounting orientation
Vertical
Termination style
Solder
Rated current
Max 8.5A per pin

Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.

Request the applicable drawing

Product overview

Wire-to-board connector. Wire-to-board connector. Series configuration parameters: Pitch: 3.0 mm; Mounting orientation: Vertical; Termination style: Solder.

Discuss this product requirement

Product features

01

Pitch

3.0 mm

02

Mounting orientation

Vertical

03

Termination style

Solder

04

Rated current

Max 8.5A per pin

05

Connection type

Snap-On

Product images

 Wire-to-board connector · 3.0 mm · Vertical · Insulation resistance ≥1000MΩ
· Wire-to-board connector · 3.0 mm · Vertical · Insulation resistance ≥1000MΩ

Technical specifications

Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.

Mechanical & connection

Mechanical & connection
DurabilityHigh
Termination styleSolder
Mating Cycles≥30 cycles
Pitch3.0 mm
Mounting orientationVertical

Electrical & signal

Electrical & signal
Rated currentMax 8.5A per pin
Rated voltage600V AC/DC
Contact resistance< 20 mΩ max after mating cycles
Insulation resistance≥1000MΩ
Withstand voltageAC 1500V, 1min no breakdown

Materials & finish

Materials & finish
Platingtin plating
HousingPA66, UL94V-0 Black
Contact materialBrass Alloy
Platingtin plating / gold plating optional

Environmental conditions

Environmental conditions
Temperature range-40 To 85 °C

Other specifications

Other specifications
Connection typeSnap-On
ContactBrass With gold plating Over 50U
Vibration / ShockCompliant with EIA-364, no discontinuity
Reflow solderingPeak temp 260℃, compatible with SMT reflow

Drawings & technical files

Wire-to-board connector drawing request

After selecting the connection configuration, review its dimensions, pin assignment and installation requirements. Include the required configuration in your request.

Request this product drawing

Selection questions

What is the connection pitch?

Pitch: 3.0 mm. The PCB footprint or mating interface must use the pitch of the selected configuration.

What mounting arrangement is used?

Mounting orientation: Vertical. Check installation clearance and mating geometry for this configuration.

What termination arrangement is used?

Termination style: Solder. Check installation clearance and mating geometry for this configuration.

What current values and conditions apply?

Rated current: Max 8.5A per pin. Keep each value with its stated standard, class and test condition.

Confirm the configuration. Get a quote.

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Connection configuration

Purchase requirements

Budget workspace

USD / pc

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