Pitch
3.0 mm
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Series specification range: Pitch: 3.0 mm · Termination style: Solder
Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.
Wire-to-board connector. Wire-to-board connector. Series configuration parameters: Pitch: 3.0 mm; Termination style: Solder; Connection type: Snap-On.
Discuss this product requirement3.0 mm
Solder
Snap-On
-40 To 85 °C
tin plating

Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.
| Durability | High |
|---|---|
| Termination style | Solder |
| Pitch | 3.0 mm |
| Plating | tin plating |
|---|---|
| Material & Plating | Housing: UL94V-0, Halogen-Free Nylon Terminal: Copper alloy, Tin plating (Gold plating optional) Buckle: Integrated rubber shell lock |
| Temperature range | -40 To 85 °C |
|---|
| Connection type | Snap-On |
|---|---|
| Contact | Brass With gold plating Over 50U |
| Soldering Guide | Solder Temp: 260℃ max, 5s max reflow soldering through hole PCB soldering |
After selecting the connection configuration, review its dimensions, pin assignment and installation requirements. Include the required configuration in your request.
Request this product drawingPitch: 3.0 mm. The PCB footprint or mating interface must use the pitch of the selected configuration.
Termination style: Solder. Check installation clearance and mating geometry for this configuration.
Connection type: Snap-On.
Temperature range: -40 To 85 °C.
Share the model or required specification, quantity and delivery target.
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