Pitch
1.25 mm, Single Row
Wire-to-board connector
Product image is temporarily unavailableProduct appearance · configuration depends on the selected modelEnlarge image
Wire connectors
Wire-to-board connector · 1.25 mm, Single Row · Contact count: 2 / 4 / 6 / 8 / 10 Pin
Series specification range: Pitch: 1.25 mm, Single Row · Positions: 2 / 4 / 6 / 8 / 10 Pin
Quotation and selection support
- Pitch
- 1.25 mm, Single Row
- Positions
- 2 / 4 / 6 / 8 / 10 Pin
- Mounting type
- right angle 90°, SMT Gull-wing with Hold-down Solder Nails
- Termination style
- Solder
Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.
Product overview
Wire-to-board connector. Wire-to-board connector. Series configuration parameters: Pitch: 1.25 mm, Single Row; Positions: 2 / 4 / 6 / 8 / 10 Pin; Mounting type: right angle 90°, SMT Gull-wing with Hold-down Solder Nails.
Discuss this product requirementProduct features
Positions
2 / 4 / 6 / 8 / 10 Pin
Mounting type
right angle 90°, SMT Gull-wing with Hold-down Solder Nails
Termination style
Solder
Rated current
1.0 A per contact
Product images
Technical specifications
Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.
Mechanical & connection
| Durability | High |
|---|---|
| Termination style | Solder |
| Pitch | 1.25 mm, Single Row |
| Positions | 2 / 4 / 6 / 8 / 10 Pin |
| Mounting type | right angle 90°, SMT Gull-wing with Hold-down Solder Nails |
| Recommended Mating Cycles | 30 cycles (tin plating); 500 cycles (Gold Flash) |
| PCB Pad Pitch | 1.25 ± 0.10 mm |
Electrical & signal
| Rated current | 1.0 A per contact |
|---|---|
| Rated voltage | 125 V AC/DC |
| Maximum Contact Resistance | ≤20 mΩ |
| Minimum Insulation Resistance | ≥100 MΩ |
| Withstanding Voltage | 250 V AC / 1 min |
Materials & finish
| Plating | tin plating |
|---|---|
| Housing material | LCP / PA66, UL94 V-0 Flame Retardant |
| Contact material | Brass |
| Plating | Tin over Nickel (Standard); Gold Flash over Nickel (Optional) |
Environmental conditions
| Temperature range | -40 To 85 °C |
|---|---|
| Operating temperature | -25 ℃ ~ +85 ℃ |
Other specifications
| Connection type | Snap-On |
|---|---|
| Contact | Brass With gold plating Over 50U |
| Mating Direction | Horizontal Side-Entry |
Drawings & technical files
Wire-to-board connector drawing request
After selecting the connection configuration, review its dimensions, pin assignment and installation requirements. Include the required configuration in your request.
Request this product drawingSelection questions
What is the connection pitch?
Pitch: 1.25 mm, Single Row. The PCB footprint or mating interface must use the pitch of the selected configuration.
How many positions or contacts are specified?
Positions: 2 / 4 / 6 / 8 / 10 Pin. Where a range or multiple options are shown, select the required count and pin assignment.
What mounting arrangement is used?
Mounting type: right angle 90°, SMT Gull-wing with Hold-down Solder Nails. Check installation clearance and mating geometry for this configuration.
What termination arrangement is used?
Termination style: Solder. Check installation clearance and mating geometry for this configuration.
Confirm the configuration. Get a quote.
Share the model or required specification, quantity and delivery target.