Pitch
1.2 mm (0.047")
Wire-to-board connector
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Wire connectors
Wire-to-board connector · 1.2 mm (0.047")
Series specification range: Pitch: 1.2 mm (0.047") · Applicable Wire Gauge: 30-28 AWG
Quotation and selection support
- Pitch
- 1.2 mm (0.047")
- Applicable Wire Gauge
- 30-28 AWG
- Termination style
- Solder
- Rated Current per Contact
- 1.5 A (AC/DC)
Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.
Product overview
Wire-to-board connector. Wire-to-board connector. Series configuration parameters: Pitch: 1.2 mm (0.047"); Applicable Wire Gauge: 30-28 AWG; Termination style: Solder.
Discuss this product requirementProduct features
Applicable Wire Gauge
30-28 AWG
Termination style
Solder
Rated Current per Contact
1.5 A (AC/DC)
Connection type
Snap-On
Product images
Technical specifications
Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.
Mechanical & connection
| Durability | High |
|---|---|
| Termination style | Solder |
| Pitch | 1.2 mm (0.047") |
| Mated height | 1.55-1.65 mm |
| Termination-Header | SMT surface mount |
| Termination-Receptacle | Crimp terminal |
| Mating Cycles | Minimum 30 cycles |
Electrical & signal
| Rated Current per Contact | 1.5 A (AC/DC) |
|---|---|
| Rated voltage | 50 V AC / DC |
| Maximum Contact Resistance | ≤20 mΩ |
| Minimum Insulation Resistance | ≥100 MΩ |
| Withstand voltage | 500 V AC / 1 minute |
Wire & cable
| Applicable Wire Gauge | 30-28 AWG |
|---|
Materials & finish
| Plating | tin plating |
|---|---|
| Housing color | Black |
| Housing material | High-temperature resistant thermoplastic |
| Terminal material | Copper-nickel-silicon alloy/phosphor bronze |
| Contact plating | Tin / Gold over nickel (optional) |
Environmental conditions
| Temperature range | -40 To 85 °C |
|---|---|
| Operating Temperature Range | -40 ℃ ~ +105 ℃ |
Other specifications
| Connection type | Snap-On |
|---|---|
| Contact | Brass With gold plating Over 50U |
| Mating Type | Vertical wire-to-board |
| SMT Soldering Profile | Follow standard SMT reflow profile; peak temp ≤260 ℃, duration ≤10s |
Drawings & technical files
Wire-to-board connector drawing request
After selecting the connection configuration, review its dimensions, pin assignment and installation requirements. Include the required configuration in your request.
Request this product drawingSelection questions
What is the connection pitch?
Pitch: 1.2 mm (0.047"). The PCB footprint or mating interface must use the pitch of the selected configuration.
What is specified for Applicable Wire Gauge?
Applicable Wire Gauge: 30-28 AWG.
What termination arrangement is used?
Termination style: Solder. Check installation clearance and mating geometry for this configuration.
What current values and conditions apply?
Rated Current per Contact: 1.5 A (AC/DC). Keep each value with its stated standard, class and test condition.
Confirm the configuration. Get a quote.
Share the model or required specification, quantity and delivery target.