Wire-to-board connector
 Wire-to-board connector · 1.25 mm · Contact count: 2-20 Positions
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Wire connectors

Wire-to-board connector · 1.25 mm · Contact count: 2-20 Positions

Series specification range: Pitch: 1.25 mm · Pin count: 2-20 Positions

Quotation and selection support
Pitch
1.25 mm
Pin count
2-20 Positions
Mounting
Surface-Mount SMD, Tape & Reel packaging
Termination style
Solder

Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.

Request the applicable drawing

Product overview

Wire-to-board connector. Wire-to-board connector. Series configuration parameters: Pitch: 1.25 mm; Pin count: 2-20 Positions; Mounting: Surface-Mount SMD, Tape & Reel packaging.

Discuss this product requirement

Product features

01

Pitch

1.25 mm

02

Pin count

2-20 Positions

03

Mounting

Surface-Mount SMD, Tape & Reel packaging

04

Termination style

Solder

05

Rated current

1A per pin (AWG 28-32)

Product images

 Wire-to-board connector · 1.25 mm · Contact count: 2-20 Positions
· Wire-to-board connector · 1.25 mm · Contact count: 2-20 Positions

Technical specifications

Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.

Mechanical & connection

Mechanical & connection
DurabilityHigh
Termination styleSolder
Pitch1.25 mm
Pin count2-20 Positions
MountingSurface-Mount SMD, Tape & Reel packaging
LockingFriction lock for secure mating

Electrical & signal

Electrical & signal
Rated current1A per pin (AWG 28-32)
Rated voltage125V AC/DC
Maximum Contact Resistance≤ 20 mΩ
Minimum Insulation Resistance≥ 1000 MΩ
Withstanding Voltage500V AC / 1 min

Materials & finish

Materials & finish
Platingtin plating
Contact materialPhosphor Bronze
Contact platingFull gold plated over Nickel base
Housing materialHigh-temp thermoplastic, UL94V-0

Environmental conditions

Environmental conditions
Temperature range-40 To 85 °C
Operating temperature-40 ℃ ~ +105 ℃
Storage temperature-25 ℃ ~ +60 ℃

Other specifications

Other specifications
Connection typeSnap-On
ContactBrass With gold plating Over 50U
TypeHorizontal SMD Female Wafer (Wire-to-Board)
RowSingle Row
Mating DirectionHorizontal / right angle to PCB
Soldering ProfileCompliant with lead-free SMT reflow (Peak 260 ℃ max)

Drawings & technical files

Wire-to-board connector drawing request

After selecting the connection configuration, review its dimensions, pin assignment and installation requirements. Include the required configuration in your request.

Request this product drawing

Selection questions

What is the connection pitch?

Pitch: 1.25 mm. The PCB footprint or mating interface must use the pitch of the selected configuration.

How many positions or contacts are specified?

Pin count: 2-20 Positions. Where a range or multiple options are shown, select the required count and pin assignment.

What mounting arrangement is used?

Mounting: Surface-Mount SMD, Tape & Reel packaging. Check installation clearance and mating geometry for this configuration.

What termination arrangement is used?

Termination style: Solder. Check installation clearance and mating geometry for this configuration.

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Connection configuration

Purchase requirements

Budget workspace

USD / pc

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