Wire-to-board connector
 Wire-to-board connector · 1.25 mm · Horizontal / right angle SMT
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Wire connectors

Wire-to-board connector · 1.25 mm · Horizontal / right angle SMT

Series specification range: Pitch: 1.25 mm · Mounting style: Horizontal / right angle SMT

Quotation and selection support
Pitch
1.25 mm
Mounting style
Horizontal / right angle SMT
Termination style
Solder
Rated Current per Contact
1.0 A

Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.

Request the applicable drawing

Product overview

Wire-to-board connector. Wire-to-board connector. Series configuration parameters: Pitch: 1.25 mm; Mounting style: Horizontal / right angle SMT; Termination style: Solder.

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Product features

01

Pitch

1.25 mm

02

Mounting style

Horizontal / right angle SMT

03

Termination style

Solder

04

Rated Current per Contact

1.0 A

05

Connection type

Snap-On

Product images

 Wire-to-board connector · 1.25 mm · Horizontal / right angle SMT
· Wire-to-board connector · 1.25 mm · Horizontal / right angle SMT

Technical specifications

Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.

Mechanical & connection

Mechanical & connection
DurabilityHigh
Termination styleSolder
Pitch1.25 mm
Mounting styleHorizontal / right angle SMT
Locking methodBuilt-in buckle latch
Mating CyclesMin 30 cycles

Electrical & signal

Electrical & signal
Rated Current per Contact1.0 A
Rated voltage50 V AC / DC
Maximum Contact Resistance≤30 mΩ (initial)
Minimum Insulation Resistance≥1000 MΩ @ 500 V DC
Withstand voltage250 V AC / 1 min

Materials & finish

Materials & finish
Platingtin plating
Housing materialLCP high-temperature thermoplastic
Contact materialPhosphor Bronze
Contact platingtin plating (standard); Gold flash optional

Environmental conditions

Environmental conditions
Temperature range-40 To 85 °C
Operating Temperature Range-40 °C ~ +105 °C

Other specifications

Other specifications
Connection typeSnap-On
ContactBrass With gold plating Over 50U
Mating DirectionSide-entry wire-to-board
Reflow Soldering ConditionPeak temp 260 °C ±5 °C, duration 5-10 sec

Drawings & technical files

Wire-to-board connector drawing request

After selecting the connection configuration, review its dimensions, pin assignment and installation requirements. Include the required configuration in your request.

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Selection questions

What is the connection pitch?

Pitch: 1.25 mm. The PCB footprint or mating interface must use the pitch of the selected configuration.

What mounting arrangement is used?

Mounting style: Horizontal / right angle SMT. Check installation clearance and mating geometry for this configuration.

What termination arrangement is used?

Termination style: Solder. Check installation clearance and mating geometry for this configuration.

What current values and conditions apply?

Rated Current per Contact: 1.0 A. Keep each value with its stated standard, class and test condition.

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Connection configuration

Purchase requirements

Budget workspace

USD / pc

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