Wire-to-board connector
 Wire-to-board connector · 2.0 mm · Contact count: 2 ~ 20P, single row
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Wire connectors

Wire-to-board connector · 2.0 mm · Contact count: 2 ~ 20P, single row

Series specification range: Pitch: 2.0 mm · Number of positions: 2 ~ 20P, single row

Quotation and selection support
Pitch
2.0 mm
Number of positions
2 ~ 20P, single row
PCB Mount Type
through hole DIP
Applicable Wire Gauge
22-30 AWG crimp wire harness

Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.

Request the applicable drawing

Product overview

Wire-to-board connector. Wire-to-board connector. Series configuration parameters: Pitch: 2.0 mm; Number of positions: 2 ~ 20P, single row; PCB Mount Type: through hole DIP.

Discuss this product requirement

Product features

01

Pitch

2.0 mm

02

Number of positions

2 ~ 20P, single row

03

PCB Mount Type

through hole DIP

04

Applicable Wire Gauge

22-30 AWG crimp wire harness

05

Termination style

Solder

Product images

 Wire-to-board connector · 2.0 mm · Contact count: 2 ~ 20P, single row
· Wire-to-board connector · 2.0 mm · Contact count: 2 ~ 20P, single row

Technical specifications

Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.

Mechanical & connection

Mechanical & connection
DurabilityHigh
Termination styleSolder
Pitch2.0 mm
Locking methodPositive-lock buckle (latch)
Number of positions2 ~ 20P, single row
Mating CyclesMin. 300 cycles
Retention force≥40N (fully mated status)
Unmating Force8-25N
PCB Mount Typethrough hole DIP

Electrical & signal

Electrical & signal
Rated current2A per contact
Rated voltage250V AC/DC
Maximum Withstand Voltage800V AC / 1 min
Contact resistance≤30 mΩ Max
Insulation resistance≥1000 MΩ Min

Wire & cable

Wire & cable
Applicable Wire Gauge22-30 AWG crimp wire harness

Materials & finish

Materials & finish
Platingtin plating
Housing materialNylon66 / PA9T, UL94V-0
Contact platingStandard: Tin over nickel; Optional: Gold flash

Environmental conditions

Environmental conditions
Temperature range-40 To 85 °C
Operating temperature-25℃ ~ +85℃
Storage temperature-40℃ ~ +105℃

Other specifications

Other specifications
Connection typeSnap-On
ContactBrass With gold plating Over 50U
Connector TypeWire-to-Board Female Vertical Header (through hole)
Contact TerminalPhosphor Bronze
Soldering Processthrough hole wave soldering
Soldering Temperature & Time260 ℃ max, ≤5 seconds

Drawings & technical files

Wire-to-board connector drawing request

After selecting the connection configuration, review its dimensions, pin assignment and installation requirements. Include the required configuration in your request.

Request this product drawing

Selection questions

What is the connection pitch?

Pitch: 2.0 mm. The PCB footprint or mating interface must use the pitch of the selected configuration.

How many positions or contacts are specified?

Number of positions: 2 ~ 20P, single row. Where a range or multiple options are shown, select the required count and pin assignment.

What mounting arrangement is used?

PCB Mount Type: through hole DIP. Check installation clearance and mating geometry for this configuration.

What is specified for Applicable Wire Gauge?

Applicable Wire Gauge: 22-30 AWG crimp wire harness.

Confirm the configuration. Get a quote.

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Connection configuration

Purchase requirements

Budget workspace

USD / pc

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