Number of positions
8 Pins
Micro SD / TF card connector
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I/O & data connectors
Micro SD / TF card connector · Contact count: 8 Pins · SMT Surface Mount · Housing material LCP, UL94V-0
Series specification range: Number of positions: 8 Pins · Mounting method: SMT Surface Mount
Quotation and selection support
- Number of positions
- 8 Pins
- Mounting method
- SMT Surface Mount
- Rated voltage
- 100 V DC Max
- Rated Current per Contact
- 0.5 A DC Max
Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.
Product overview
Micro SD / TF card connector. Micro SD / TF card connector. Series configuration parameters: Number of positions: 8 Pins; Mounting method: SMT Surface Mount; Rated voltage: 100 V DC Max.
Discuss this product requirementProduct features
Mounting method
SMT Surface Mount
Rated voltage
100 V DC Max
Rated Current per Contact
0.5 A DC Max
Material
Plastic
Product images
Technical specifications
Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.
Mechanical & connection
| Number of positions | 8 Pins |
|---|---|
| Mounting method | SMT Surface Mount |
| Pitch | 1.10 mm |
| Mechanical Durability | 5000 mating cycles minimum |
| Height | 1.8 mm |
Electrical & signal
| Rated Current per Contact | 0.5 A DC Max |
|---|---|
| Rated voltage | 100 V DC Max |
| Initial Contact Resistance | ≤100 mΩ |
| Insulation resistance | ≥1000 MΩ @ DC 500V |
| Withstanding Voltage | 500 V AC, 1 minute, no breakdown |
Materials & finish
| Plating | tin plating |
|---|---|
| Material | Plastic |
| Contact pin material | Phosphor Bronze |
| Shell material | SUS Stainless Steel |
| Housing material | LCP, UL94V-0 |
| Contact material | Phosphor Bronze Copper Alloy |
| Mating Contact Plating | Gold over Nickel |
| PCB Terminal Plating | Tin |
Environmental conditions
| Operating temperature | -40 ℃ ~ +85 ℃ |
|---|---|
| Storage temperature | -40 ℃ ~ +85 ℃ |
Other specifications
| Contact | Brass With gold plating Over 50U |
|---|---|
| Product type | Push-Push Self-Eject Micro SD / TF Card Socket |
| Thermal Shock | -40 ℃ ↔ +85 ℃, 5 cycles pass |
| IR Reflow Soldering | Peak temp 260 ℃ ±5 ℃, dwell ≤5s; follow JEDEC standard |
| Manual soldering | Only for lab prototype; max 3s at 350 ℃, mass-production forbidden |
| Salt Spray Test | 48h, no corrosion on SUS shell & contacts |
Drawings & technical files
Micro SD / TF card connector drawing request
After selecting the connection configuration, review its dimensions, pin assignment and installation requirements. Include the required configuration in your request.
Request this product drawingSelection questions
How many positions or contacts are specified?
Number of positions: 8 Pins. Where a range or multiple options are shown, select the required count and pin assignment.
What mounting arrangement is used?
Mounting method: SMT Surface Mount. Check installation clearance and mating geometry for this configuration.
What voltage values and standards apply?
Rated voltage: 100 V DC Max; Withstanding Voltage: 500 V AC, 1 minute, no breakdown. Keep each value with its stated standard, class and test condition.
What current values and conditions apply?
Rated Current per Contact: 0.5 A DC Max. Keep each value with its stated standard, class and test condition.
Confirm the configuration. Get a quote.
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