Pin count
19 Pins
Micro SD / TF card connector
Product image is temporarily unavailableProduct appearance · configuration depends on the selected modelEnlarge image
I/O & data connectors
Micro SD / TF card connector · Contact count: 19 Pins · SMT Surface Mount
Series specification range: Pin count: 19 Pins · Mounting method: SMT Surface Mount
Quotation and selection support
- Pin count
- 19 Pins
- Mounting method
- SMT Surface Mount
- Rated voltage
- 30 V DC Max
- Rated Current per Contact
- 0.5 A DC Max
Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.
Product overview
Micro SD / TF card connector. Micro SD / TF card connector. Series configuration parameters: Pin count: 19 Pins; Mounting method: SMT Surface Mount; Rated voltage: 30 V DC Max.
Discuss this product requirementProduct features
Mounting method
SMT Surface Mount
Rated voltage
30 V DC Max
Rated Current per Contact
0.5 A DC Max
Material
Plastic
Product images
Technical specifications
Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.
Mechanical & connection
| Pin count | 19 Pins |
|---|---|
| Mounting method | SMT Surface Mount |
| Stacking Height | 1.6 mm |
| Mechanical Durability | 5000 mating cycles minimum |
| Insertion / Extraction Force | 3-8 N |
| Height | 1.6 mm |
Electrical & signal
| Rated Current per Contact | 0.5 A DC Max |
|---|---|
| Rated voltage | 30 V DC Max |
| Initial Contact Resistance | ≤80 mΩ |
| Insulation resistance | ≥1000 MΩ @ DC 500 V |
| Withstanding Voltage | 500 V AC, 1 minute, no breakdown |
| Moisture Resistance | 90-95% RH, 96 h, no performance degradation |
Materials & finish
| Plating | tin plating |
|---|---|
| Material | Plastic |
| Contact pin material | Phosphor Bronze |
| Shell material | Stainless Steel |
| Housing material | High-temp LCP, UL94V-0 |
| Contact material | Phosphor-bronze Copper Alloy |
| Mating Contact Plating | Gold over Nickel |
| SMT Termination Plating | Tin |
Environmental conditions
| Operating temperature | -40 ℃ ~ +85 ℃ |
|---|---|
| Storage temperature | -40 ℃ ~ +85 ℃ |
Other specifications
| Contact | Brass With gold plating Over 50U |
|---|---|
| Supported Card Types | UFS Card, UHS-II Micro SD, UHS-I Micro SD (backward compatible) |
| Operation Type | Push-Push Eject Type |
| Thermal Shock | -40 ℃ ↔ +85 ℃, 5 cycles pass |
| IR Reflow Soldering | Peak temp 255 ℃ ±5 ℃, dwell ≤5 s; follow JEDEC standard |
| Manual soldering | Prototype debug only; max 3 s @350 ℃; mass-production SMT mandatory |
| Salt Spray Test | 48 h, no corrosion on shell & contact area |
Drawings & technical files
Micro SD / TF card connector drawing request
After selecting the connection configuration, review its dimensions, pin assignment and installation requirements. Include the required configuration in your request.
Request this product drawingSelection questions
How many positions or contacts are specified?
Pin count: 19 Pins. Where a range or multiple options are shown, select the required count and pin assignment.
What mounting arrangement is used?
Mounting method: SMT Surface Mount. Check installation clearance and mating geometry for this configuration.
What voltage values and standards apply?
Rated voltage: 30 V DC Max; Withstanding Voltage: 500 V AC, 1 minute, no breakdown. Keep each value with its stated standard, class and test condition.
What current values and conditions apply?
Rated Current per Contact: 0.5 A DC Max. Keep each value with its stated standard, class and test condition.
Confirm the configuration. Get a quote.
Share the model or required specification, quantity and delivery target.