Pitch
0.5mm
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Series specification range: Pitch: 0.5mm · Mounting type: SMT Surface Mount
Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.
FPC / FFC connector. FPC / FFC connector. Series configuration parameters: Pitch: 0.5mm; Mounting type: SMT Surface Mount; Material: LCP.
Discuss this product requirement0.5mm
SMT Surface Mount
LCP
2.2
gold plated

Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.
| Pitch | 0.5mm |
|---|---|
| Height | 2.2 |
| Pitch | 0.5 mm |
| Total Height | 2.2 mm |
| Mounting type | SMT Surface Mount |
| Locking method | Butterfly Flip-Cover ZIF |
| Available Pin Count | 4-60P customizable |
| Mating Cycles | Min. 30 times |
| Rated current | 0.5 A per pin |
|---|---|
| Rated voltage | 50 V AC |
| Contact resistance | ≤50 mΩ (initial) |
| Insulation resistance | ≥1000 MΩ |
| Compatible Cable Thickness | 0.3 mm ±0.03 mm (FPC / FFC) |
|---|
| Material | LCP |
|---|---|
| Plating | gold plated |
| Terminal material | Brass |
| Contact material | Phosphor Bronze |
| Contact plating | Contact area: gold plating over nickel base; Solder area: tin plating |
| Operating temperature | -40 ℃ ~ +85 ℃ |
|---|
| Type | Lock |
|---|---|
| Housing / Actuator | LCP High-temp resin, UL94V-0, Halogen-free |
| Reflow Soldering (Lead-free) | Peak temp ≤260 ℃; 10-30 s at peak; max 2 reflow cycles |
| Manual soldering | Max 320 ℃, ≤3 seconds per point; avoid touching plastic housing |
After selecting the connection configuration, review its dimensions, pin assignment and installation requirements. Include the required configuration in your request.
Request this product drawingPitch: 0.5mm. The PCB footprint or mating interface must use the pitch of the selected configuration.
Mounting type: SMT Surface Mount. Check installation clearance and mating geometry for this configuration.
Material: LCP.
Height: 2.2.
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