Pitch
1.5 mm (0.059 in)
Wire-to-board connector
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Wire connectors
Wire-to-board connector · 1.5 mm (0.059 in) · Contact count: 2P ~ 15P
Series specification range: Pitch: 1.5 mm (0.059 in) · Number of positions: 2P ~ 15P
Quotation and selection support
- Pitch
- 1.5 mm (0.059 in)
- Number of positions
- 2P ~ 15P
- Mounting method
- Surface-Mount SMT (PCB vertical)
- Termination style
- Solder
Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.
Product overview
Wire-to-board connector. Wire-to-board connector. Series configuration parameters: Pitch: 1.5 mm (0.059 in); Number of positions: 2P ~ 15P; Mounting method: Surface-Mount SMT (PCB vertical).
Discuss this product requirementProduct features
Number of positions
2P ~ 15P
Mounting method
Surface-Mount SMT (PCB vertical)
Termination style
Solder
Rated Current per Contact
2.5 A max. per contact
Product images
Technical specifications
Parameters may cover a series or several configurations. Confirm ratings for the selected contact count, dimensions and termination.
Mechanical & connection
| Durability | High |
|---|---|
| Termination style | Solder |
| Pitch | 1.5 mm (0.059 in) |
| Number of positions | 2P ~ 15P |
| Mounting method | Surface-Mount SMT (PCB vertical) |
| Mating Cycles | Min. 10 cycles Molex |
| Contact Retention Force | > 9.8 N (tin plating) |
Electrical & signal
| Rated Current per Contact | 2.5 A max. per contact |
|---|---|
| Rated voltage | 250 V AC RMS / DC |
| Maximum Contact Resistance | ≤20 mΩ |
| Minimum Insulation Resistance | ≥1000 MΩ |
| Withstanding Voltage | 500 V AC |
Materials & finish
| Plating | tin plating |
|---|---|
| Housing material | High-temp PA / PA6T, UL94 V-0 flame rating |
| Contact material | Copper-alloy brass |
| Contact plating | tin plated (standard); gold plating (optional) |
Environmental conditions
| Temperature range | -40 To 85 °C |
|---|---|
| Operating Temperature Range | -55 °C ~ +105 °C |
Other specifications
| Connection type | Snap-On |
|---|---|
| Contact | Brass With gold plating Over 50U |
| Reflow Soldering Profile | Complies J-STD-020; peak temp 260 °C, 5-10s duration |
Drawings & technical files
Wire-to-board connector drawing request
After selecting the connection configuration, review its dimensions, pin assignment and installation requirements. Include the required configuration in your request.
Request this product drawingSelection questions
What is the connection pitch?
Pitch: 1.5 mm (0.059 in). The PCB footprint or mating interface must use the pitch of the selected configuration.
How many positions or contacts are specified?
Number of positions: 2P ~ 15P. Where a range or multiple options are shown, select the required count and pin assignment.
What mounting arrangement is used?
Mounting method: Surface-Mount SMT (PCB vertical). Check installation clearance and mating geometry for this configuration.
What termination arrangement is used?
Termination style: Solder. Check installation clearance and mating geometry for this configuration.
Confirm the configuration. Get a quote.
Share the model or required specification, quantity and delivery target.